Technical

Product Model

DHI-DDR-C300S4G26

DHI-DDR-C300S8G26

DHI-DDR-C300S16G26

DHI-DDR-C300S32G26

Capacity

4 GB

8 GB

16 GB

32 GB

Type

SODIMM

Applicable Model

DDR4 laptop

Voltage

1.2 V

CAS Latency

CL19

Operating Frequency

2666 MHz

Number of Pins

260

Operating Temperature

0 °C to +70 °C (+32 °F to 158 °F)

Storage Temperature

­20 °C to +85 °C (-4 °F to +185 °F)

Operating Humidity

25%–85% (non-condensing)

Warranty

Lifetime

Product Dimensions

69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

Packaging Dimensions

165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

Net Weight

8.5 g (0.02 lb)

Gross Weight

36 g (0.08 lb)

Reference Information

Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.

Technical Specification

Technical

Product Model

DHI-DDR-C300S4G32

DHI-DDR-C300S8G32

DHI-DDR-C300S16G32

DHI-DDR-C300S32G32

Capacity

4 GB

8 GB

16 GB

32 GB

Type

SODIMM

Applicable Model

DDR4 laptop

Voltage

1.2 V

CAS Latency

CL22

Operating Frequency

3200 MHz

Number of Pins

260

Operating Temperature

0 °C to +70 °C (+32 °F to 158 °F)

Storage Temperature

­20 °C to +85 °C (-4 °F to +185 °F)

Operating Humidity

25%–85% (non-condensing)

Warranty

Lifetime

Product Dimensions

69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

Packaging Dimensions

165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

Net Weight

8.5 g (0.02 lb)

Gross Weight

36 g (0.08 lb)

Reference Information

Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.

Technical Specification

Technical

Product Model

DHI-DDR-C300U4G26

DHI-DDR-C300U8G26

DHI-DDR-C300U16G26

DHI-DDR-C300U32G26

Capacity

4 GB

8 GB

16 GB

32 GB

Type

UDIMM

Applicable Model

DDR4 desktop

Voltage

1.2 V

CAS Latency

CL19

Operating Frequency

2666 MHz

Number of Pins

288

Operating Temperature

0 °C to +70 °C (+32 °F to 158 °F)

Storage Temperature

­20 °C to +85 °C (-4 °F to +185 °F)

Operating Humidity

25%–85% (non-condensing)

Warranty

Lifetime

Product Dimensions

69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

Packaging Dimensions

165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

Net Weight

16 g (0.04 lb)

Gross Weight

44 g (0.10 lb)

Reference Information

Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.

Technical Specification

Technical

Product Model

DHI-DDR-C300U4G32

DHI-DDR-C300U8G32

DHI-DDR-C300U16G32

DHI-DDR-C300U32G32

Capacity

4 GB

8 GB

16 GB

32 GB

Type

UDIMM

Applicable Model

DDR4 desktop

Voltage

1.2 V

CAS Latency

CL22

Operating Frequency

3200 MHz

Number of Pins

288

Operating Temperature

0 °C to +70 °C (+32 °F to 158 °F)

Storage Temperature

­20 °C to +85 °C (-4 °F to +185 °F)

Operating Humidity

25%–85% (non-condensing)

Warranty

Lifetime

Product Dimensions

69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

Packaging Dimensions

165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

Net Weight

16 g (0.04 lb)

Gross Weight

44 g (0.10 lb)

Reference Information

Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.